Solutions

Semiconductor Packaging and Test Equipment

Semiconductor Packaging and Test Equipment built by Teamwork Automation in Taichung, Taiwan. Also known as semiconductor sealing and testing equipment or semiconductor packaging equipment. Standalone or line-integrated.

Process stage
Semiconductor Process Equipment
Motor types
Semiconductor packaging, not motor production
Request a quotation Book a video call

Product description

What this machine does

  • Teamwork has developed and built semiconductor equipment since 2006 - one of few automation builders serving both the electronics and motor industries.
  • Equipment built includes Micro SD and DDR3 test equipment, wafer de-taping equipment, and automatic wafer loading, unloading and baking equipment.
  • Applies the same motion, control and precision engineering used in our motor production lines.

Specifications

What this machine is rated for

Also known as Semiconductor sealing and testing equipment · Semiconductor packaging equipment

  • Industry: semiconductor packaging and test
  • Examples: Micro SD / DDR3 testing, wafer de-taping, wafer loading and baking

Capabilities shown are typical. Values outside this range can be quoted on request.

The catalogue

Get the full catalogue (PDF)

Enter your work email and we'll send the complete Teamwork Automation machine catalogue straight to your inbox. Specifications on this site stay open — only the full PDF asks for an email.